METAL COATED POLYMER ENCAPSULATED ELECTRONIC MODULE AND
METAL-COATED, POLYMER-ENCAPSULATED ELECTRONICS MODULES AND METHODS FOR MAKING THE SAME
PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING
Planar power module with high power density packaging
Electronic power module assemblies and control logic with direct-cooling vapor chamber systems
ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING VAPOR CHAMBER SYSTEMS
ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING HEAT PIPE SYSTEMS
Electronic power module assemblies and control logic with direct-cooling heat pipe systems
ELEKTRONISCHE LEISTUNGSMODULBAUGRUPPEN UND STEUERLOGIK MIT DIREKTKÜHLUNGS-DAMPFKAMMERSYSTEMEN