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Annual L. Ray Buckendale lecture; Electronic systems testing and validation for commercial vehicles
Vehicle crashworthiness in real world conditions
Development of autobody sheet materials for crash performance
Energy absorption in hybrid composite structures
Woven polypropylene structures
10 Gb/s wavelength conversion in an integrated SOA/DFB laser
Controlling structural collapse in off axis impact of rail vehicles by retrospective modification
Design and performance of energy absorbing subfloor structures in aerospace applications
All-optical digital information processing
Interconnection network improves functionality in car environment
A new approach to body electronics shown by the BMW 850I
On board diagnosis as the central interface for modern vehicle electronics
A distributed controller system with a hierarchical structure for PROMETHEUS-functions
Why we need new functionalities for automobiles
New harness architecture and diagnostic ways
A new architecture for car electronics
Introduction to the session architecture and partitioning
Fault tree analysis (F.T.A.) in automotive design for reliability evaluation and improvement
Component architectures for dependable electronical automotive systems
Contribution to integrated vehicle networking
Trend in electronic components for automotive applications
Functional integration in driver-vehicle interface design
New possibilities of featuring the man-car-interface by an integrating display-control-concept
Dedicated automotive controllers from 8 Bit to 32 Bit
New levels of integration in automotive electronics
Functional integration of vehicle chassis systems
Graphic displays in cars - an intelligent solution to the integration of MMI-functions
Mechatronic sensors in integrated vehicle architecture
On board communication: current status of standardisation and requirements of network performance
Barriers to Integrating RFID Baggage Security into Network Operations
CAD of Solder Joints for Self-Aligned Assemblies
Hybrid Integration of AlGaAs/GaAs Laser Diode on Si Substrate
Waveguide and Diffractive Coupling Elements for Optoelectronic Packaging
Hybrid Integration of Electrical and Optical Interconnect for MCMs Applications
Simulation Tools for Free-Space Optical Interconnects Based on Computer-Generated Holograms
Rapid Prototyping of Photonic Integrated Circuits
Optoelectronic Integration of Thin Film Devices for Photonic Interconnect
A Three-Dimensional Optical Interconnection Network for Fine-Grain Parallel Architectures
Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections
Fabrication Issues for Free-Space Optics at the Board Packaging Level
Direction of Optoelectronics Research at ARPA
U.S.-Japan Joint Optoelectronics Project
Demonstration of GaAs LEDs on SI Chips Using Epitaxial Liftoff
Packaging of Liquid Crystal on Silicon Modulators Using Solder