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    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archiv | 1998
    selected and investigated. The alloys are compared for flip chip technology applicability, microstructure and phase compositions are presented ...
    Verlag: Institute of Electrical and Electronics Engineers (IEEE) , New York
    Schlagwörter: Altern (Werkstoff) , Kraftwagen

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archiv | 1998
    ) are used to optimise reliability and media resistance for automotive requirements of harsh environment conditions for under-the-hood ...
    Verlag: Institute of Electrical and Electronics Engineers (IEEE) , New York
    Schlagwörter: Kraftwagen