Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources
Implementation of a decision support system for scheduling semiconductor test operations
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Alternative substrates for power electronic circuits : an experimental evaluation
Performance evaluation of dispatching rules for semiconductor testing operations
Application of ink screening models to solder paste printing in SMT assembly
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology