New Semiconductor Technologies Challenge Package and System Setup (Invited paper)
Current Status of Pronostics Techniques and Application to Power Electronics (Invited paper)
Pure Low Temperature Joining Technique Power Module for Automotive Production Needs
Low Temperature Sinter Technology Die Attachment for Power Electronic Applications
1200 V 6 A SiC BJTs with very Low VCESAT and Fast Switching
Thermoelectric Cooling for Power Density Maximisation of Power Electronics Converters
Development of a Highly Compact and Efficient Solar Inverter with Silicon Carbide Transistors
Mechanical Characterisation of an Au-Ge Solder Alloy for High Temperature Electronic Devices
Power Module with Solid State Circuit Breakers for Fault-Tolerant Applications
Fast and Accurate Simulation of Time-Variant Air-Cooling Systems
Mixed Switched Mode and Linear Lithium Ion Battery Tester for High Power and Large Bandwidth
Power Module with Additional Low Inductive Current Path
Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective Optimisation
How Materials Behaviour Affects Power Electronics Reliability
Fault Tolerant Drives for Aerospace Applications (Invited paper)
Preliminary Study for the Integrated Design of an Electro-Mechanical Wing De-Icing System