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A Survey of Terrestrial Approaches to the Challenge of Lunar Dust Containment
Devices and microsystems in the automotive industry
High Performance Motor and Inverter System for a Newly Developed Electric Vehicle
Performance Improvement of Automotive Acoustic Signal Devices using Electric PWM Control
Herausforderung Hochtemperaturelektronik. Vom BMBF-Verbundprojekt zum ZVEI-Arbeitskreis
Effect Analysis of Form Factor on Thermo-Electric Generator Performance
Mid-IR Semiconductor Lasers for Chemical Sensing
Design of a SiC Based Variable Voltage Converter for Hybrid Electric Vehicle
Comparison of the power dissipation with modern semiconductor devices in zero voltage switching
Obtaining Diagnostic Coverage Metrics Using Rapid Prototyping of Multicore Systems
Mid-IR III-V Semiconductor Diode Lasers for Trace Gas Monitoring
Power Module Design Verification for xEV Application Under Extreme Conditions
Speech Response System for Automotive Applications
The Multi-National Semiconductor and Automotive Electronics
Rapid, Tunable Error Detection with Execution Fingerprinting
Complete power semiconductor devices for electric vehicle
The easy way to get aerospace quality semiconductors
A 42V Inverter/Rectifier for ISA using Discrete Semiconductor Components
Zuverlässigkeit von Elektroniksystemen - der Beitrag der Chip-Industrie
Development of Fabrication Technology for MOS-Based Power Switching Devices in SiC
Semiconductors Compound Films with Optoeletronic Appliqued
Silicon Carbide Power Devices for Use in Hybrid-EV
Today's Military Semiconductor Manufacturers Embracing Dual-Use Technology
The Role of Microprocessors in Future Automotive Electronics
Speech Synthesis – Technology and Applications
Control of Microwave Plasma for Ignition Enhancement Using Microwave Discharge Igniter
Avoiding Electrical Overstress for Automotive Semiconductors by New Connecting Concepts
Plastic Ball-Grid-Arrays (PBGA): Are they ready for environmentally harsh Aerospace applications?
High-Temperature, Distributed Control using Custom CMOS ASICs
X-by-Wire: Opportunities, Challenges and Trends
Power electronics reliability in rail traction
A lightweight 8-14 micrometer thermal imager
In-house Testing of Highly Hardware-dependent Software