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IV
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packaging
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title: Optoelectronic interconnects and packaging IV
Optoelectronic interconnects and packaging IV : 12 - 14 February 1997, San Jose, California
Thermal management of free space optical interconnects [3005-06]
Optoelectronic backplane interconnect technology development: POINT (Invited Paper) [3005-03]
Recent progress in short-distance optical interconnects (Invited Paper) [3005-15]
Shrinkage correction of volume phase holograms for optical interconnects [3005-48]
Equal fan-out optical interconnects using DuPont photopolymer films [3005-31]
Optoelectronic design of the simultaneous optical multiprocessor exchange bus (SOME-Bus) [3005-42]