Stability of spore-based biosensing systems under extreme conditions
The changing automotive environment: high-temperature electronics
Model for BGA and CSP reliability in automotive underhood applications
Plastic encapsulated components for cars
Variable emissivity through MEMS technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)