301–350 von 595 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Technical Study for the Fixation of Sand Dunes in Alkasra, Deir-Elzor, Syria - 1985

    Jabbour, E. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Aspects of Desertification Problems in Nigeria

    Egboka, B. C. E. / Nwogute, N. S. / International Centre for Theoretical Physics et al. | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Solder paste for tomorrow's electronics manufacturing technology

    Lee, Ning-Cheng | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Simulation and experimental study of a semi-active suspension with an electrorheological damper

    Wu, X.M. / Wong, J.Y. / Sturk, M. et al. | Tema Archiv | 1994
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic PCBA line simulator

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Li-S batteries : the challenges, chemistry, materials, and future perspectives

    Demir-Cakan, Rezan | TIBKAT | 2017
    Verlag: World Scientific] , New Jersey , London , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)

    Edwards, T. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES

    Li, Li | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Partnering with Customers by Capturing Their Voice

    Morand, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Computer-Aided Design Based on a Deductive Object-Oriented Database

    Raphel, J. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995

    Tilley, K. J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS : SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS

    Ogunjimi, A. O. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Non-Contact Temperature Measurement in SM Component Rework

    Geren, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electrical Properties of Solder Filled Anisotropically Conductive Adhesives

    Savolainen, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Experiments

    Moeller, J. T. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    The EPSRC/D & IPG electronics assembly sector workshop

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Applications of electrorheological fluid in shock absorbers

    Wei, Chenguan / Fu Zhao | Tema Archiv | 1994
    Verlag: World Scientific , Singapore

    Alternative substrates for power electronic circuits : an experimental evaluation

    Barnwell, Peter | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Special issue: Selected papers from the Third International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT2017)

    International Conference on Electrical and Information Technologies for Rail Transportation | TIBKAT | 2018
    Verlag: World Scientific , New Jersey , London , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints

    Nambisan, B. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore