Technical Study for the Fixation of Sand Dunes in Alkasra, Deir-Elzor, Syria - 1985
Aspects of Desertification Problems in Nigeria
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Simulation and experimental study of a semi-active suspension with an electrorheological damper
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
Li-S batteries : the challenges, chemistry, materials, and future perspectives
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
Partnering with Customers by Capturing Their Voice
Computer-Aided Design Based on a Deductive Object-Oriented Database
China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995
Non-Contact Temperature Measurement in SM Component Rework
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
Electrical Properties of Solder Filled Anisotropically Conductive Adhesives
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
The EPSRC/D & IPG electronics assembly sector workshop
Applications of electrorheological fluid in shock absorbers
Alternative substrates for power electronic circuits : an experimental evaluation
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints
A low-cost automated handling system for SPC evaluation of packaging processes