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    Thermal performance of plastic-encapsulated and hermetically sealed components for automotive applications

    Musiejovsky, L. / Nicolics, J. / Hauser, H. et al. | Tema Archiv | 1998
    characteristics of mono-chip and multi-chip components are discussed. Although, the thermal conductivity of ceramic is high compared to plastic moldings ...
    Verlag: Institute of Electrical and Electronics Engineers (IEEE) , New York