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KAPSELUNG
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3-layered 3D flex based MCM: electrical characterization and reliability issues
300 ampere, 1000 volt hermetic Darlington transistor
Accelerated testing of flip chip packages under dynamic load
Acceleration threshold switches from an additive electroplating MEMS process
A Critical Review on Assessment of Self Healing Performance of Bioconcrete
Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments