Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)
Coating Material, Phenolic Resin, PTFE Filled Pigmented, 150 °C (302 °F) Cure
Adhesive, Modified Epoxy Moderate Heat Resistant, 120 °C (250 °F) Curing, Film Type