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Multilayer alumina substrates for ECU (automotive electronics)
Stability of spore-based biosensing systems under extreme conditions
Variable emissivity through MEMS technology
Plastic encapsulated components for cars
The changing automotive environment: high-temperature electronics
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Model for BGA and CSP reliability in automotive underhood applications
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
3-layered 3D flex based MCM: electrical characterization and reliability issues