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Verpackung
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Trends In Transport Packaging as Noted in Award Winning Case Histories
Quantifying the Vibration Environment of a Small Parcel System
Understanding Today's Transport Environment Measuring Recorders
The Connection with Material and Component Specifications
Less Waste on the Loading Dock: Competitive Strategy and the Reduction of Logistical Packaging Waste
rf optoelectric transmitter and receiver arrays on silicon wafer boards (Invited Paper) [2691-14]
Fluxless Sn-Ag solder ball formation for flip-chip application [2691-08]
Deep-UV laser-based nano-patterning with holographic techniques [6459-14]
Case History of Rapid Design & Certification in Hazardous Materials Packaging
Selecting A Vibration Test Method to Meet Your Business Objectives
Single-mode aray optoelectric packaging based on actively aligned planar optical waveguide [2691-16]
Alignment tolerancing of free-space MCM-to-MCM optical interconnects [2691-13]
Laser micromachining of optical biochips [6459-08]
Optimizing Unit-Load Design - A New Systems Approach to Improving Material Handling Efficiency
Determining Parameters for Evaluating Protective Properties of Molded Pulp Cushioning
What Motivates International Packaging Regulations?
Potentials of fiber laser technology in microfabrication [6459-18]