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packaging
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keywords:(Electronic packaging)
The NASA Electronic Parts and Packaging (NEPP) Program - Overview for FY14
Considerations for GPU SEE Testing
Packaging for Electromagnetic Compatibility
Considerations for a Proton Single Event Effects (SEE) Guideline
New Market for Terrestrial Single-Event Effects: Autonomous Vehicles
A General Purpose on Board Processor for Spacecraft Application
Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package
The NASA Electronic Parts and Packaging (NEPP) Program: An Overview
Radiation Hardness Assurance (RHA): Challenges and New Considerations
Radiation Hardness Assurance (RHA): Challenges and New Considerations
NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond
NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond
NASA Electronic Parts and Packaging (NEPP) Program - Update
Monitoring the Shipping Environment of the GCA/MRAPCON System
Monitoring the Shipping Environment of the GCA/MRAPCON System