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    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archiv | 2005
    Schlagwörter: Kriechen (Werkstoff)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001
    Schlagwörter: Kriechen (Werkstoff)

    The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach

    Jung, E. / Kasulke, P. / Giebler, R. et al. | Tema Archiv | 1997
    Schlagwörter: Altern (Werkstoff)

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archiv | 1998
    Schlagwörter: Altern (Werkstoff)

    Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

    Ansorge, F. / Becker, K.F. / Ehrlich, R. et al. | Tema Archiv | 1997
    Schlagwörter: Altern (Werkstoff)