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Model for BGA and CSP reliability in automotive underhood applications
Accelerated testing of flip chip packages under dynamic load
Variable emissivity through MEMS technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)