1–10 von 10 Ergebnissen
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    Title Page i

    IEEE | 2012

    Title Page iii

    IEEE | 2012

    Design for Transport Packaging of the Small Test Equipment

    Yuan, Yan / Zhao, Peng | Tema Archiv | 2012
    Taking paper tearing resistance apparatus as an example, study on the transport packaging of small test equipments has been conducted. It ...
    Schlagwörter: Transportverpackung

    The System Design of Vibration Transmission Test for Cushioning Packaging Materials

    Xing, Yue Qing / Ding, Jin-Sheng | Tema Archiv | 2012
    and so on. This test system obtains the vibration transmission curves by the test of vibration transmission characteristics of packaging ...

    Development and Application of Time-temperature Indicators Used on Food during the Cold Chain Logistics

    Lu, Lixin / Zheng, Weizhou / Lv, Zhiye et al. | Tema Archiv | 2013
    , a new enzymatic TTI based on enzyme reaction, diffusion and enzyme demobilization technology is developed. The mathematical model of TTI is ...

    Structural Optimal Design of Honeycomb Paperboard Pallet

    Li, Zhi-Qiang / Zhang, Li-Na | Tema Archiv | 2012
    Honeycomb Paperboard Pallet has great value in transporting packaging domain. On the basis of pallet test and structure characteristics of ...
    Schlagwörter: Transportverpackung

    Analysis of Structural Parameters of Flexible Spiral Conveyor Blades and Study of its Transmission Power

    Tian, Ye / Sun, Zhi-Hui / Zhang, Li | Tema Archiv | 2012
    transportation resistance torque was set up, and the impact of structure parameter of flexible spiral blades on transportation power was analyzed. A ...

    A New Method for Constructing Damage Boundary Curve Using Shock Response Spectra

    Yuan, Zhi-qing / Song, Bao-Feng | Tema Archiv | 2012
    on excitation ones. The new DBC is beneficial to overcome the conversation brought by the traditional DBC in transport packaging design, and ...

    History and Recent Progress of MEMS Physical Sensors

    Muro, Hideo | Tema Archiv | 2012
    , II) Integration with advanced CMOS circuitry, III) Improvement on wafer-level packaging technology, IV) Adoption of new materials. Several ...

    Integrated Microsystems

    Esashi, Masayoshi / Tanaka, Shuji | Tema Archiv | 2012
    Technology called MEMS (Micro Electro Mechanical Systems) or microsystems are heterogeneous integration on silicon chips and play important ...
    Schlagwörter: WLP (Wafer-Level-Packaging)