1–20 von 214 Ergebnissen
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    Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources

    Workshop on Materials Science and Physics of Non-Conventional Energy Sources / International Centre for Theoretical Physics | TIBKAT | 1991
    Verlag: World Scientific , Singapore [u.a.]

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic PCBA line simulator

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Performance evaluation of dispatching rules for semiconductor testing operations

    Uzsoy, Reha | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Printed circuit board panel layout optimization : a module in integrating PCB design and manufacturing databases

    Banerjee, Prashant | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Conductive adhesives as die-bonding materials for power electric modules

    Lenkkeri, Jaakko | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Multiple-criteria robust design of electronic devices

    Bag-Chi, Tapan P. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic ECAD interface

    Ang, Mui Kiang | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    SMT in Singapore: a window into the challenges and practice

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Multichip modules (MCMs) : a review of the status quo

    Jahn, J. Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore