Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources
Application of ink screening models to solder paste printing in SMT assembly
Implementation of a decision support system for scheduling semiconductor test operations
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
Performance evaluation of dispatching rules for semiconductor testing operations
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling