121–140 von 230 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly

    Lu, J. C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints

    Nambisan, B. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS

    Rösner, Bela | Online Contents | 1995
    Verlag: World Scientific , Singapore

    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels

    Kristiansen, H. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Decision-Support Tool for Printed Circuit Board Assembly

    Ong, N. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

    McCutchen, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part I : Dense suspension theory

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Singapore : strategic thrusts for competitive success in the electronics industry

    Souza, R.de | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Performance evaluation of dispatching rules for semiconductor testing operations

    Uzsoy, Reha | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Printed circuit board panel layout optimization : a module in integrating PCB design and manufacturing databases

    Banerjee, Prashant | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Structure and Selection Models for Anisotropic Conductive Adhesive Films

    Li, L. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Solder paste for tomorrow's electronics manufacturing technology

    Lee, Ning-Cheng | Online Contents | 1994
    Verlag: World Scientific , Singapore