Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints
RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels
A Decision-Support Tool for Printed Circuit Board Assembly
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
Computer simulation of solder paste flow, part I : Dense suspension theory
Singapore : strategic thrusts for competitive success in the electronics industry
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
Performance evaluation of dispatching rules for semiconductor testing operations
Structure and Selection Models for Anisotropic Conductive Adhesive Films
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology