Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Application of ink screening models to solder paste printing in SMT assembly
Performance evaluation of dispatching rules for semiconductor testing operations
Implementation of a decision support system for scheduling semiconductor test operations
Alternative substrates for power electronic circuits : an experimental evaluation
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers