Shape Decomposition Using Part-Models of Different Granularity
The Estimation of Curves to Subpixel Accuracy
Approximate Convexity in N-Dimensions
Representing Orthogonal Multidimensional Objects by Vertex Lists
Two Dual Representations of Mathematical Morphology Based on the Parallel Normal Transport Property
From Pixels to Edges in Medical Radiographs: A Pattern Recognition Approach to Edge Detection
Multiscale Contour Approximation Based on Scale Space Analysis with a Stable Gaussian Smoothing
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Simulation and experimental study of a semi-active suspension with an electrorheological damper
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
Asia's manufacturing industry gearing up for the high-value electronics market
The current status and future of electronics manufacturing in Penang
The EPSRC/D & IPG electronics assembly sector workshop
Applications of electrorheological fluid in shock absorbers