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ADHESIVE COMPOUND, EPOXY High Temperature Application
ADHESIVE COMPOUND, EPOXY Medium Temperature Application
Adhesive Compound, Epoxy Resin High Temperature Application
ADHESIVE; ELASTIC Fuel and Oil Resistant - Buna N Type
ADHESIVE, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
Adhesive Film, Epoxy-Base for High Durability Structural Adhesive Bonding
Adhesive Film, Epoxy-Base, High Durability For 95 °C (200 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 120 °C (250 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 175 °C (350 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 215 °C (420 °F) Service
Adhesive, Foaming, Honeycomb, Core Splice, Structural −54 to +177 °C (−65 to +350 °F)
Adhesive, Foaming, Honeycomb Core Splice, Structural −55 to +82 °C (−65 to +180 °F)
ADHESIVE, MODIFIED EPOXY Moderate Heat Resistant, 250 F (121.1 C) Curing, Film Type
Adhesive/Sealant, Fluorosilicone Aromatic Fuel Resistant, One-Part Room Temperature Vulcanizing
Adhesive/Sealant, Fluorosilicone Aromatic Fuel Resistant, One-Part Room Temperature Vulcanizing
ADHESIVE/SEALANT, FLUOROSILICONE Aromatic Fuel Resistant, One-Part Room Temperature Vulcanizing