Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources
Microstructural study of automobile components
Application of ink screening models to solder paste printing in SMT assembly
Implementation of a decision support system for scheduling semiconductor test operations
Performance evaluation of dispatching rules for semiconductor testing operations
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Alternative substrates for power electronic circuits : an experimental evaluation
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
An intelligent decision support environment for PCB assembly
Computer simulation of solder paste flow, part I : Dense suspension theory
Singapore : strategic thrusts for competitive success in the electronics industry
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Simulation and experimental study of a semi-active suspension with an electrorheological damper
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
Portable communications : trends in systems and component technology
Asia's manufacturing industry gearing up for the high-value electronics market
The current status and future of electronics manufacturing in Penang
A low-cost automated handling system for SPC evaluation of packaging processes
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
Particle identification system for semiconductor manufacturing
The significance of desoldering and resoldering methods in robotic automated rework
Component procurement under demand uncertainty for mainframe subassemblies
Postponement of packaging and product differentiation for lower logistics costs
The EPSRC/D & IPG electronics assembly sector workshop