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    Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources

    Workshop on Materials Science and Physics of Non-Conventional Energy Sources / International Centre for Theoretical Physics | TIBKAT | 1991
    Verlag: World Scientific , Singapore [u.a.]

    Microstructural study of automobile components

    Siddiqi, S.A. / Iftakhar, F. / Farooq, T. | Tema Archiv | 1992
    Verlag: World Scientific , Singapore, New Jersey

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Performance evaluation of dispatching rules for semiconductor testing operations

    Uzsoy, Reha | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Printed circuit board panel layout optimization : a module in integrating PCB design and manufacturing databases

    Banerjee, Prashant | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic PCBA line simulator

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    SMT in Singapore: a window into the challenges and practice

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Multichip modules (MCMs) : a review of the status quo

    Jahn, J. Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Conductive adhesives as die-bonding materials for power electric modules

    Lenkkeri, Jaakko | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Multiple-criteria robust design of electronic devices

    Bag-Chi, Tapan P. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic ECAD interface

    Ang, Mui Kiang | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Alternative substrates for power electronic circuits : an experimental evaluation

    Barnwell, Peter | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part I : Dense suspension theory

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Singapore : strategic thrusts for competitive success in the electronics industry

    Souza, R.de | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Solder paste for tomorrow's electronics manufacturing technology

    Lee, Ning-Cheng | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Simulation and experimental study of a semi-active suspension with an electrorheological damper

    Wu, X.M. / Wong, J.Y. / Sturk, M. et al. | Tema Archiv | 1994
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Portable communications : trends in systems and component technology

    Gross, D. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Asia's manufacturing industry gearing up for the high-value electronics market

    Lee, Loke Chong | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The current status and future of electronics manufacturing in Penang

    Haniff, Dato' Noor Ahmad Mokhtar | Online Contents | 1994
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Advanced superfine-pitch technology

    Wakigawa, Asahiro | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Particle identification system for semiconductor manufacturing

    Katayama, Hiroshi | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The significance of desoldering and resoldering methods in robotic automated rework

    Geren, N. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Component procurement under demand uncertainty for mainframe subassemblies

    Srinivasan, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Postponement of packaging and product differentiation for lower logistics costs

    Howard, K. A. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The EPSRC/D & IPG electronics assembly sector workshop

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore