0.1 mu m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
Accelerated testing of flip chip packages under dynamic load
A comparison of Si CMOS and SiGe BiCMOS technologies for automotive radars
Alternative solders for flip chip applications in the automotive environment
A new Ag/Pd conductor for automotive applications
A new methodology for SEE testing and simulations
A performance measure for a VHSIC avionic system: mission dependent availability
A powertrain control SOI BiCMOS LSI for an automotive application
Automotive electronics: designing custom ICs for a harsh environment
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Characteristics of devices and integrated circuits at 260 Cel for Navy applications
Design of fail safe computer systems for railway control
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
EMC-aware design on a microcontroller for automotive applications
Hi rel linear IC selection and specification procedures