New Semiconductor Technologies Challenge Package and System Setup (Invited paper)
Current Status of Pronostics Techniques and Application to Power Electronics (Invited paper)
Pure Low Temperature Joining Technique Power Module for Automotive Production Needs
Low Temperature Sinter Technology Die Attachment for Power Electronic Applications
1200 V 6 A SiC BJTs with very Low VCESAT and Fast Switching
Thermoelectric Cooling for Power Density Maximisation of Power Electronics Converters
Fast and Accurate Simulation of Time-Variant Air-Cooling Systems
Mixed Switched Mode and Linear Lithium Ion Battery Tester for High Power and Large Bandwidth