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1–20 von 190 Ergebnissen
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    Potential Applications of Active Antenna Technologies for Emerging NASA Space Communications Scenarios

    J. A. Nessel / J. M. Downey / B. L. Schoenholz et al. | NTIS | 2020
    Schlagwörter: Integrated circuits

    Crosscutting: Internal Payloads Panel Discussion

    J. Pellish | NTIS | 2018
    Schlagwörter: Integrated circuits

    NASA Electronic Parts and Packaging (NEPP) Program - Technology

    K. A. Label / M. J. Sampson | NTIS | 2017
    Schlagwörter: Integrated circuits

    NEPP Program Task 17-294 Government Working Group

    P. Mcmanus / K. Laird / M. Sampson | NTIS | 2017
    Schlagwörter: Integrated circuits

    DDR Memories

    E. J. Wyrwas | NTIS | 2017
    Schlagwörter: Application specific integrated circuits

    NASA Goddard Thermal Technology Overview 2017

    D. Butler / T. Swanson | NTIS | 2017
    Schlagwörter: Application specific integrated circuits

    NASA Electronic Parts and Packaging (NEPP) Program Plans

    K. A. Label / M. J. Sampson | NTIS | 2016
    Schlagwörter: Integrated circuits

    NASA Electronic Parts and Packaging (NEPP) Program: Overview and Roadmap for FY16

    K. A. LaBel / M. J. Sampson | NTIS | 2016
    Schlagwörter: Integrated circuits

      NASA Electronic Parts and Packaging (NEPP) Program: Overview and Roadmap for FY16

      K. A. LaBel / M. J. Sampson | NTIS | 2016
      Schlagwörter: Integrated circuits

    NASA Pathways Internship: Spring 2016

    O. I. Alvarez | NTIS | 2016
    Schlagwörter: Application specific integrated circuits

    NEPP Roadmaps, COTS, and Small Missions

    K. A. LaBel / M. J. Sampson | NTIS | 2016
    Schlagwörter: Integrated circuits

    Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

    L. Chen / P. G. Neudeck / D. J. Spry et al. | NTIS | 2016
    Schlagwörter: Integrated circuits

    NASA Electronic Parts and Packaging (NEPP) Program: An Overview

    K. A. Label / M. J. Sampson | NTIS | 2016
    Schlagwörter: Integrated circuits

      NASA Electronic Parts and Packaging (NEPP) Program: An Overview

      K. A. LaBel / M. J. Sampson | NTIS | 2016
      Schlagwörter: Integrated circuits

      NASA Electronic Parts and Packaging (NEPP) Program: An Overview

      K. A. Label / M. J. Sampson | NTIS | 2016
      Schlagwörter: Integrated circuits

    NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

    K. A. LaBel / M. J. Sampson | NTIS | 2016
    Schlagwörter: Integrated circuits

      NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

      K. A. Label / M. J. Sampson | NTIS | 2015
      Schlagwörter: Integrated circuits

    RFID Enabled Autonomous Logistics Management

    P. Fink / J. '. James | NTIS | 2016
    Schlagwörter: Application specific integrated circuits