151–200 von 222 Ergebnissen
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    Design and development of a generic ECAD interface

    Ang, Mui Kiang | Online Contents | 1993
    Verlag: World Scientific , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)

    Edwards, T. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards

    Law, H. -W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING

    Marwah, Manish | Online Contents | 1996
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    IC MANUFACTURING IN THE 1990s

    Knepper, Jonathan | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES

    Klosterman, Don | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing

    Chung, C.-W. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Partnering with Customers by Capturing Their Voice

    Morand, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Computer-Aided Design Based on a Deductive Object-Oriented Database

    Raphel, J. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995

    Tilley, K. J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Stencil Optimization via Flow Control

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges

    Whalley, D. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Qualify lmprovement in a Printed Circuit Board Manufacturer: A Case Study Examination

    DeWsbury, M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Environmental Factors in Parametric Design of Computer Chassis

    Sheng, P. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Integrated Decision-Support Environment for DFX Audit

    Souza, R. B. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium

    Mannan, S. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    PCB Defect Behavior Associated with the Use of Three No-Clean Fluxes and Varying Wave Soldering Process Atmospheres

    Giacobbe, F. W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Advanced superfine-pitch technology

    Wakigawa, Asahiro | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Particle identification system for semiconductor manufacturing

    Katayama, Hiroshi | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The significance of desoldering and resoldering methods in robotic automated rework

    Geren, N. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Component procurement under demand uncertainty for mainframe subassemblies

    Srinivasan, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Postponement of packaging and product differentiation for lower logistics costs

    Howard, K. A. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Prospects for li-ion batteries and emerging energy electrochemical systems

    Monconduit, Laure / Croguennec, Laurence | TIBKAT | 2018
    Verlag: World Scientific , New Jersey , London , Singapore

    THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS : SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS

    Ogunjimi, A. O. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Non-Contact Temperature Measurement in SM Component Rework

    Geren, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electrical Properties of Solder Filled Anisotropically Conductive Adhesives

    Savolainen, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore