Design and development of a generic ECAD interface
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES
A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
Partnering with Customers by Capturing Their Voice
Computer-Aided Design Based on a Deductive Object-Oriented Database
China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995
A low-cost automated handling system for SPC evaluation of packaging processes
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Qualify lmprovement in a Printed Circuit Board Manufacturer: A Case Study Examination
Environmental Factors in Parametric Design of Computer Chassis
An Integrated Decision-Support Environment for DFX Audit
Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium
The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly
Particle identification system for semiconductor manufacturing
The significance of desoldering and resoldering methods in robotic automated rework
Component procurement under demand uncertainty for mainframe subassemblies
Postponement of packaging and product differentiation for lower logistics costs
Prospects for li-ion batteries and emerging energy electrochemical systems
Non-Contact Temperature Measurement in SM Component Rework
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
Electrical Properties of Solder Filled Anisotropically Conductive Adhesives