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Modern inertial navigation technology and its application
Completely mechanical quick changeable joints for multipurpose explosive ordnance disposal robots
Analysis of electric machines and drive systems for unmanned ground vehicle applications
Energetic reaction of metal carbides - experiments, modelling and application
US military embraces commercial technology
Humanitarian mine detection six-legged walking robot COMET-II with two manipulators
Using an analytical model of simulation in the design of lightweight armours
Why use PEMs in military equipment: Users' response
Thermoplastic adhesives: alternative to thermosets
Battery-free power for unattended ground sensors
The Demo III UGV program: a testbed for autonomous navigation research
An economic comparison of hot pressing vs. pressureless sintering for transparent spinel armor
Manufacturability of high frequency power MOSFETs
An articulated robotic scanner for mine detection: a novel approach to vehicle mounted systems
Department of Defense Joint Robotics Program
Studies on the properties of fast burning cords as gas generators
Overview and update of the Demo III experimental unmanned vehicle program
Performance evaluation of UGV obstacle detection with CCD/FLIR stereo vision and LADAR
Impact of aging on radiation hardness(CMOS SRAMs)
Robust/low cost SSPCs are finally available
A paperless system of reporting and analyzing field failure data for IFTE ATS
Soldier-centric knowledge engineering: lessons from TED
Low-cost, high density non volatile memory for military and space applications
Applying software process to Virtual Instrument based test program set development
UAV sensor systems for close-range operations
Grain boundary engineering of silicon carbide by means of coprecipitation
A test platform implementing SPC in a low-volume, high-mix test department
Recent advances in the quality of CVD diamond optical components
Aluminum nitride coatings for protection of diamond at high-temperature in air
MEMS inertial rate and acceleration sensor
The development of a large three-axis magnetic field susceptibility test (L-TAMFST) system
Microwave multichip modules using low cost microwave chip on flex packaging technology