Utilization of Supplementary Cementitious Materials in HPC: From rheology to pore structure
Utilization of Supplementary Cementitious Materials in HPC: From rheology to pore structure
Structural and electromechanical behavior evaluation of polymer-copper nanocomposites
Modeling of Stresses in an Axisymmetric Composite Patch-Repair System (AIAA 2015-2069)