Proceedings of the Workshop on Materials Science and Physics of Non-Conventional Energy Sources
Microstructural study of automobile components
Application of ink screening models to solder paste printing in SMT assembly
Implementation of a decision support system for scheduling semiconductor test operations
Performance evaluation of dispatching rules for semiconductor testing operations
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Sub-pixel resolution for low-cost SMT component placement inspection systems