191–200 von 595 Ergebnissen
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    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Computing and optimization for DC power systems of electric transport

    Bosyi, Dmytro / Sablin, Oleh / Kosariev, Yevhen | TIBKAT | 2020
    Verlag: World Scientific , New Jersey , London , Singapore

    Special issue on new advances on formation control of autonomous vehicles

    Zhao, Shiyu / Meng, Ziyang / Zheng, Ronghao | TIBKAT | 2019
    Verlag: World Scientific , New Jersey , London , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The development of electrorheological fluids for an automotive semi-active suspension system

    Weyenberg, T.R. / Pialet, J.W. / Petek, N.K. | Tema Archiv | 1996
    Verlag: World Scientific , Singapore

    Li-S batteries : the challenges, chemistry, materials, and future perspectives

    Demir-Cakan, Rezan | TIBKAT | 2017
    Verlag: World Scientific] , New Jersey , London , Singapore

    A continuously variable ER damper with energy generation

    Kim, K.S. / Choi, S.B. / Cheong, C.C. et al. | Tema Archiv | 1997
    Verlag: World Scientific , Singapore