Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
Black TiO2 nanomaterials for energy applications
RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING
Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4
Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules
An Integrated Decision-Support Environment for DFX Audit
Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium
The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly
Gap Enhancement in Superconductors: Where Did It Go?
Structure and Selection Models for Anisotropic Conductive Adhesive Films
Design Study of Toroidal 6 MWh SMES for Maglev
Portable communications : trends in systems and component technology
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Protection versus Desertification
Interregional Cooperation in Mapping
Mapping from Space Photographs for the Monitoring and Exploitation of Water Resources
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
The Characteristics of Sand Dunes and its Stabilization in China
Prospects for li-ion batteries and emerging energy electrochemical systems
Qualify lmprovement in a Printed Circuit Board Manufacturer: A Case Study Examination
Environmental Factors in Parametric Design of Computer Chassis
Asia's manufacturing industry gearing up for the high-value electronics market
The current status and future of electronics manufacturing in Penang
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Particle identification system for semiconductor manufacturing
The significance of desoldering and resoldering methods in robotic automated rework
Component procurement under demand uncertainty for mainframe subassemblies
Postponement of packaging and product differentiation for lower logistics costs
Technical Study for the Fixation of Sand Dunes in Alkasra, Deir-Elzor, Syria - 1985
Aspects of Desertification Problems in Nigeria
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly