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Kraftfahrzeugelektronik
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keywords:("Kraftfahrzeugelektronik")
Reliability potential of epoxy based encapsulants for automotive applications
New principle for front light systems in automotive applications
Multichip modules for automotive applications
Modellierung und Anwendung von Silizium-Mikrofonsystemen
Microsystems packaging for automotive applications
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Micro-mechatronics in automotive applications
Integration of micro-mechatronics in automotive applications
High temperature potential of flip chip assemblies for automotive applications
Flip chip technology for multi chip modules
Alternative solders for flip chip applications in the automotive environment
3D integration of image sensor SiP using TSV silicon interposer