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Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Why use PEMs in military equipment: Users' response
Waveguide Transfer Switch Driver Multichip Module
Vibration-induced fatigue failures in bonding wires used in stacked chip modules
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
Utilizing off-the-shelf parts for the next generation of space exploration
Universal microcomputer electrical testing system II (UNIMETS II)
Titanium S-IC skin section Phase I report, 29 Jun. - 10 Dec. 1965
Titanium S-IC Skin Section Phase I Report, 29 Jun. - 10 Dec. 1965
Three-Dimensional Modeling of Power Distribution Systems
The South African experience with negotiated versus competitively tendered bus contracts
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
Thermal analysis of a high density TMOS used in an automotive solide-state relay
The prediction of the radiation-stimulated failure rate for integrated circuits
The past, present and future of EEE components for space application; COTS-the next generation