301–350 von 558 Ergebnissen
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    Non-Contact Temperature Measurement in SM Component Rework

    Geren, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electrical Properties of Solder Filled Anisotropically Conductive Adhesives

    Savolainen, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES

    Li, Li | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints

    Nambisan, B. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards

    Law, H. -W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING

    Marwah, Manish | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4

    Rettori, C. / Sanjurjo, J. A. / Oseroff, B. S. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules

    Luo, W. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    The EPSRC/D & IPG electronics assembly sector workshop

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Applications of electrorheological fluid in shock absorbers

    Wei, Chenguan / Fu Zhao | Tema Archiv | 1994
    Verlag: World Scientific , Singapore

    Alternative substrates for power electronic circuits : an experimental evaluation

    Barnwell, Peter | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Experiments

    Moeller, J. T. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Special issue: Selected papers from the Third International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT2017)

    International Conference on Electrical and Information Technologies for Rail Transportation | TIBKAT | 2018
    Verlag: World Scientific , New Jersey , London , Singapore

    Computer simulation of solder paste flow, part I : Dense suspension theory

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Singapore : strategic thrusts for competitive success in the electronics industry

    Souza, R.de | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Performance evaluation of dispatching rules for semiconductor testing operations

    Uzsoy, Reha | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Printed circuit board panel layout optimization : a module in integrating PCB design and manufacturing databases

    Banerjee, Prashant | Online Contents | 1993
    Verlag: World Scientific , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Li-S batteries : the challenges, chemistry, materials, and future perspectives

    Demir-Cakan, Rezan | TIBKAT | 2017
    Verlag: World Scientific] , New Jersey , London , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Proposal for Monitoring Sand Dunes Movement by Remote Sensing

    Hassan, H. M. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    IC MANUFACTURING IN THE 1990s

    Knepper, Jonathan | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES

    Klosterman, Don | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing

    Chung, C.-W. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Partnering with Customers by Capturing Their Voice

    Morand, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Computer-Aided Design Based on a Deductive Object-Oriented Database

    Raphel, J. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995

    Tilley, K. J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore