Non-Contact Temperature Measurement in SM Component Rework
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
Electrical Properties of Solder Filled Anisotropically Conductive Adhesives
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints
Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING
Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4
Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules
The EPSRC/D & IPG electronics assembly sector workshop
Applications of electrorheological fluid in shock absorbers
Alternative substrates for power electronic circuits : an experimental evaluation
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
Computer simulation of solder paste flow, part I : Dense suspension theory
Singapore : strategic thrusts for competitive success in the electronics industry
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
Performance evaluation of dispatching rules for semiconductor testing operations
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
Li-S batteries : the challenges, chemistry, materials, and future perspectives
A low-cost automated handling system for SPC evaluation of packaging processes
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Proposal for Monitoring Sand Dunes Movement by Remote Sensing
CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES
A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
Partnering with Customers by Capturing Their Voice
Computer-Aided Design Based on a Deductive Object-Oriented Database
China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines