Multichip modules (MCMs) : a review of the status quo
Protection versus Desertification
Interregional Cooperation in Mapping
Mapping from Space Photographs for the Monitoring and Exploitation of Water Resources
Computer simulation of solder paste flow, part I : Dense suspension theory
Singapore : strategic thrusts for competitive success in the electronics industry
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
Performance evaluation of dispatching rules for semiconductor testing operations
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
The Characteristics of Sand Dunes and its Stabilization in China
CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES
A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING
Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4
Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
An Integrated Decision-Support Environment for DFX Audit
Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium
The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly
Gap Enhancement in Superconductors: Where Did It Go?
Partnering with Customers by Capturing Their Voice
Computer-Aided Design Based on a Deductive Object-Oriented Database
China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
Non-Contact Temperature Measurement in SM Component Rework
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
Electrical Properties of Solder Filled Anisotropically Conductive Adhesives
A low-cost automated handling system for SPC evaluation of packaging processes
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology