301–350 von 567 Ergebnissen
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    Multichip modules (MCMs) : a review of the status quo

    Jahn, J. Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Protection versus Desertification

    Awouda, E. H. M. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Interregional Cooperation in Mapping

    Majali, R. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Mapping from Space Photographs for the Monitoring and Exploitation of Water Resources

    El-Baz, F. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Changes in Morphologic and Aeolian Processes in the Upper Inland Niger Delta of Mali as a Function of Drought

    Jacobberger, P. A. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part I : Dense suspension theory

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Singapore : strategic thrusts for competitive success in the electronics industry

    Souza, R.de | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Performance evaluation of dispatching rules for semiconductor testing operations

    Uzsoy, Reha | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Printed circuit board panel layout optimization : a module in integrating PCB design and manufacturing databases

    Banerjee, Prashant | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Characteristics of Sand Dunes and its Stabilization in China

    Zhu, Z. / Yang, Y. / International Centre for Theoretical Physics et al. | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    IC MANUFACTURING IN THE 1990s

    Knepper, Jonathan | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES

    Klosterman, Don | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing

    Chung, C.-W. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING

    Marwah, Manish | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4

    Rettori, C. / Sanjurjo, J. A. / Oseroff, B. S. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules

    Luo, W. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)

    Edwards, T. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    An Integrated Decision-Support Environment for DFX Audit

    Souza, R. B. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium

    Mannan, S. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    PCB Defect Behavior Associated with the Use of Three No-Clean Fluxes and Varying Wave Soldering Process Atmospheres

    Giacobbe, F. W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Gap Enhancement in Superconductors: Where Did It Go?

    Dahlberg, E. D. / Schuller, I. K. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Partnering with Customers by Capturing Their Voice

    Morand, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Computer-Aided Design Based on a Deductive Object-Oriented Database

    Raphel, J. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995

    Tilley, K. J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS : SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS

    Ogunjimi, A. O. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Non-Contact Temperature Measurement in SM Component Rework

    Geren, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electrical Properties of Solder Filled Anisotropically Conductive Adhesives

    Savolainen, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore