This chapter contains sections titled: Introduction Modification of Laser Spallation Technique to Measure Thin Film‐Substrate Interface Fracture Toughness Parametric Studies Validation of Dynamic Delamination Protocol Summary
Laser Based Adhesion Testing Technique to Measure Thin Film‐Substrate Interface Toughness
Laser Technology ; 269-298
2018-02-02
30 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
Laser-enhanced adhesion and thin film formation [2777-12]
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