As part of a program to develop high temperature/high performance structural resins for aeronautical applications, imide oligomers containing terminal phenylethynyl groups with calculated number average molecular weights of 1250, 2500 and 5000 g/mol were prepared, characterized, and evaluated as adhesives and composite matrix resins. The goal of this work was to develop resin systems that are processable using conventional processing equipment into void free composites that exhibit high mechanical properties with long term high temperature durability, and are not affected by exposure to common aircraft fluids. The imide oligomers containing terminal phenylethynyl groups were fabricated into titanium adhesive specimens and IM-7 carbon fiber laminates under 0.1-1.4 MPa for 1 hr at 350-371 degree C. The lower molecular weight oligomers exhibited higher cured Tg, better processability, and better retention of mechanical properties at elevated temperature without significantly sacrificing toughness or damage tolerance than the higher molecular weight oligomer. The neat resin, adhesive and composite properties of the cured polymers will be presented.


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    Titel :

    Effect of molecular weight on the composite properties of cured phenylethynyl terminated imide oligomers


    Beteiligte:


    Erscheinungsdatum :

    1998


    Format / Umfang :

    12 Seiten, 5 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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    Properties of Imide Oligomers Containing Pendent Phenylethynyl Groups

    Connell, J. W. / Smith, J. G. / Cano, R. J. et al. | British Library Conference Proceedings | 1996



    Phenylethynyl-Terminated Polyimides

    Jensen, Brian J. / Bryant, Robert G. / Hergenrother, Paul M. | NTRS | 1994