Investigations and examination of measured transient temperature data have shown that the traditional simple 'lumped capacitance' approximation can be adapted to provide useful solutions to transient thermal design problems encountered by aerospace electronics packaging engineers. An analytical model has been developed that is ideally suited for use with computer spreadsheet applications available to desktop PC's. A derivation of the analytical model is presented and solutions are compared with measured data. Specific examples are cited where the model has been applied to optimize product design requirements, and to develop effective environmental test criteria.


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    Titel :

    Use of approximate transient thermal analysis solutions for aerospace electronics product development


    Beteiligte:
    Johnson, S.T. (Autor:in)


    Erscheinungsdatum :

    1997


    Format / Umfang :

    10 Seiten, 4 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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