The relationship between failure analysis/fault isolation and improvements in reliability and maintainability of electronic hardware is discussed. How failure analysis is an essential part of improving electronic hardware integrity and system life is examined. Three studies are presented as examples of how recommendations determined by failure investigations can eliminate recurring problems in hardware and can increase system reliability. The discussion covers manufacturing improvements: on gimbal potentiometers, on two types of electronic hybrid modules, and on HEXFET technology power transistors.


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    Titel :

    Verification of electronic material properties and characterization of electronic component failures


    Weitere Titelangaben:

    Verifikation von Materialeigenschaften fuer die Elektronik und Beschreibung von Komponentenfehlern


    Beteiligte:
    Zinger, P.C. (Autor:in) / Dobbs, B. (Autor:in) / White, E.L. (Autor:in) / Marchese, M.J. (Autor:in) / Slenski, G.A. (Autor:in)


    Erscheinungsdatum :

    1988


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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