In silicon power transistor applications, thermal cycling of the transistor may activate a failure mechanism called thermal fatigue. This phenomenon is caused by the mechanical stresses set up by the differential in the thermal expansions of the various materials used in the assembly of the transistor and heat sink. Thermal fatigue often results in cracking of the silicon pellet or fatigue of the silicon mounting interface. The author considers the avionics integrity process along with an example of a mechanical analysis using the avionics integrity approach. The example involves the determination of the stress-strain relationships found in power transistors and an experimental approach for determining cycles to failure.


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    Titel :

    An avionics integrity mechanical analysis


    Weitere Titelangaben:

    Eine mechanische Fehleranalyse von Bauelementen fuer die Avionik


    Beteiligte:


    Erscheinungsdatum :

    1988


    Format / Umfang :

    8 Seiten, 2 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    The Avionics Integrity Program

    Chou, George C. | SAE Technical Papers | 1988


    Avionics integrity program : Papers

    IEEE Dayton Section / Dayton Chapter, IEEE Aerospace and Electronic Systems Society | TIBKAT | 1988




    AVIONICS SERVER FOR HIGH INTEGRITY TABLET APPLICATIONS

    TRUE WILLARD R / BERCKEFELDT RICHARD / SARMA KALLURI R | Europäisches Patentamt | 2019

    Freier Zugriff