As integrated circuit processing technology progresses to deep sub-micron lithographies, designers increasingly adopt superintegrated approaches where several complex functions are combined on one die. At the same time, however, designers are now faced with choices in the approach to packaging: mixed IC technology and multichip packaging. This paper revie s these trends, presenting typical integrated circuits that exemplify each approach and compare their relative merits.


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    Titel :

    Future development in electronic systems is impacted both by semiconductor technology and IC assembly techniques


    Weitere Titelangaben:

    Halbleitertechnologie und Chip-Montage beeinflussen die Entwicklung elektronischer Systeme gemeinsam


    Beteiligte:
    Murari, B. (Autor:in)


    Erscheinungsdatum :

    1996


    Format / Umfang :

    6 Seiten, 5 Bilder


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch






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