As integrated circuit processing technology progresses to deep sub-micron lithographies, designers increasingly adopt superintegrated approaches where several complex functions are combined on one die. At the same time, however, designers are now faced with choices in the approach to packaging: mixed IC technology and multichip packaging. This paper revie s these trends, presenting typical integrated circuits that exemplify each approach and compare their relative merits.
Future development in electronic systems is impacted both by semiconductor technology and IC assembly techniques
Halbleitertechnologie und Chip-Montage beeinflussen die Entwicklung elektronischer Systeme gemeinsam
1996
6 Seiten, 5 Bilder
Aufsatz (Konferenz)
Englisch
Halbleitertechnologie , Chip-Montage , Multichip-Schaltung , Entwicklungstendenz , Submikrometerbereich , Lithographie , CMOS-Technik , Kraftfahrzeugelektrik , Silicium , Bipolarschaltung , NMOS-Struktur , EPROM (Festwertspeicher) , EEPROM (Festwertspeicher) , Halbleiterspeicher , Hybridschaltung , Packungsdichte (Schaltung) , Nachrichtenübertragungstechnik , Messaufnehmer , Flip-Chip-Technologie , Bonden
Advanced electronic integration techniques for future military systems
Tema Archiv | 1986
|The future of the internal combustion engine impacted by increasing electrification
Springer Verlag | 2017
|Comparison of strain rates of dart impacted plaques and pendulum impacted bumpers
Kraftfahrwesen | 1987
|