The main reason for the current efforts in the development of solid-state accelerometers is high volume applications in automotive industry. These include crash sensor for air bag, ride control, and inertial navigation. In all of these applications accelerometers have to satisfy several key requirements such as reliability, self-diagnostics, and low cost. Existing mechanical devices are not capable of meeting the requirements. Therefore, it is not surprise that the current development of solid-state accelerometers is one of the most challenging tasks in the sensor arena. The basic technology used in this endeavor is micromachining. In this paper the authors review aspects of micromachining and direct wafer bonding technology and their application to accelerometers. The examples include devices fabricated in different technologies. Also, the comments on future seamless sensing systems regarding the integration of accelerometers are presented.
Sensor technology for accelerometer applications
Sensortechnologie für Beschleunigungsmessung
1994
13 Seiten, 4 Bilder, 74 Quellen
Aufsatz (Konferenz)
Englisch
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