This paper presents an approach to construct the thermal strain spectrum and predict thermal fatigue life of leadless solder joints in automotive environment based on collected field temperature data. To develop temperature profiles, the climatic temperature of various geographical areas are investigated. The effect of sun-exposure and engine-heat dissipation on peak temperature of electronics modules located in engine compartment, engine mounted and passenger/luggage compartment are analyzed. Based on these information the strain spectrums are developed by using the rain-flow fatigue counting method. The mean-time-to-failure of the solder joints associated with chip capacitors (without heat dissipation) and chip resistors (with heat dissipation) are predicted based on Coffin-Manson equation and linear cumulative fatigue damage rule. The reliability as a function of time is estimated assuming a modified Weibull distribution. Finally, the required number of thermal cycles in accelerated qualification test is suggested based on the proposed damage equivalence technique.


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    Titel :

    Thermal fatigue reliability of leadless solder joints in automotive environment


    Weitere Titelangaben:

    Thermische Dauerzuverlässigkeit von leitungslosen Lötverbindungen in einer Automobilumgebung


    Beteiligte:
    Hu, J. (Autor:in) / Salisbury, K. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    10 Seiten, 5 Bilder, 7 Tabellen, 15 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Solder Life Prediction for Leadless Chip Carriers

    McKeown, S. A. / IEEE / AIAA | British Library Conference Proceedings | 1992





    Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics

    Hu,J.M. / Garfinkel,G.A. / Visteon Automotive Systems,US | Kraftfahrwesen | 1998