Matra Marconi Space France present here the benefits provided by Solid State Recorders (SSR), and an original solution for a Solid State Mass Memory Module concept, compliant with Space requirements. The architecture of such a Mass Memory equipment calls for several technologies, all of them presenting a high level of integration. These technologies are the use of RAM naked dice, the use of Multi Chip Module substrate to realize a first level Module, the use of multilayer cofired ceramic to constitute a high density substrate and double side hermetic package, the use of double side Surface Mount PCB to interconnect a large number of Memory Modules, the use of ASICs and Hybrids as associated components, the use of a concept of mechanical slices to stack the desired Memory volume. Depending on the type of Memory chip used, and on several architecture options, this concept allows any conventional homologated hybrid production line to product high memory density space equipments, without using any new specific unknown technology.


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    Titel :

    High-density package, cofired, multi chip module, 3D, a mass memory mixed technology for space applications


    Weitere Titelangaben:

    Dreidimensional angeordnete Multichip-Schaltungen in großer Packungsdichte für Massenspeicher in der Raumfahrt


    Beteiligte:
    Massenat, M. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    8 Seiten, Bilder, Tabellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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