CSC has been manufacturing flip chips for over ten years. Reliability data indicates that the flip chip meets or exceeds even the most optimistic quality objectives. As an example, one automotive subcontractor that manufactures prssure transducers for engine control has produced more than 2,000,000 modules over the past three years with no related field failures related to flip chips. In order to achieve the potential benefits of flip chips, a close relationship between the customer and supplier is essential. For example, CSC works closely with its customers to determine optimum solder reflow temperature profile, flux, and lead-tin content of the solder. The quality and reliability of a flip chip is contingent upon a clear understanding of the entire process including the IC fabrication and the die assembly process. When the proper care is used flip chips allow surface mount applications which otherwise would not be possible.
Achieving the theoretical limit in surface mount packaging for automotive applications
Die theoretischen Grenzen bei der Oberflaechenmontage fuer Kraftfahrzeuganwendungen
1988
8 Seiten, 2 Bilder
Aufsatz (Konferenz)
Englisch
Considerations about the use of surface mount technology in automotive electronic applications
Kraftfahrwesen | 1989
|Microsystems Packaging for Automotive Applications
British Library Conference Proceedings | 2002
|Microsystems packaging for automotive applications
Tema Archiv | 2002
|Automotive active engine mount systems
Kraftfahrwesen | 1992
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