New energy and energy saving are the two basic energy issues. This study proposes an innovative optimal method to design LEDs with high thermal spreading holder. The optimization uses the FEM combined with the simplified conjugated gradient method (SCGM). The minimal temperature of the MCPCB backside of the LEDs is obtained throughout this design. The simulations have been proofed by the experiment of IR and thermal couple measurement. The optimal temperature decreases at about 4 °C compared with the original temperature without any active cooling device. This design can prolong the LEDs' life to benefit the energy saving obviously. In addition, this design combined with the active cooling device will achieve better heat dissipation on cooling of the electronic component.


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    Titel :

    The optimal design of the thermal spreading on high power LEDs


    Beteiligte:

    Erschienen in:

    Microelectronics Journal ; 45 , 7 ; 904-909


    Erscheinungsdatum :

    2014


    Format / Umfang :

    6 Seiten, 15 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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