In this paper, the newly developed 6-pack direct liquid cooling IGBT module for the automotive application is described. The direct liquid cooling fin and the cooling liquid jacket structure have been optimized to achieve high thermal conductivity. The several Sn-Sb solder materials under the insulated substrate have been investigated with temperature cycling test and the amount of antimony (Sb) has been optimized to reduce crack growth in the solder layer under the insulated substrate. From the estimation of the ΔTj and the ΔTc power cycling lifetime and several reliability test results, the reliability of the newly developed IGBT modules with the optimized Sn-Sb solder has been achieved the requirement for the automotive application. In conclusion, the newly developed direct liquid cooling IGBT module and the optimized cooling liquid jacket can reduce the size of PCU in HEV/EV system against the conventional fin less base type 6-pack IGBT modules.


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    Titel :

    High thermal conductivity and reliability, downsized igbt module for automotive applications


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    2012


    Format / Umfang :

    10 Seiten, 14 Bilder, 6 Tabellen, 9 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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