This paper presents a new Transfer-mold Power Module (T-PM) series (called J-Series TPM) dedicated for automotive Power-Train inverter and converter applications. The J-Series T-PM are IGBT half bridge modules with current ratings of 300Aand 600A with 650V blocking voltage and 300A current rating with 1200V blocking voltage packaged in a compact thermally highly conductive packge. To provide a safe IGBT operation the T-PM IGBTs are equipped with a current sense emitter to be utilized for an external SC protection and an onchip temperature sensor diode for OT protection realization. The prepared evaluation board employing a new developed driver IC for J-Series T-PM allows an easy evaluation of the TPM's performance. The developed driver IC contains all functions to drive and protect the IGBTs. The Evaluation board is a reference design which could be used for the optimization of the drive and protection circuit of the J-Series T-PM at the customer. J-Series T-PMs are produced adopting ELV Compliant Technologies (Pb free solder) and underlying a quality control and traceability management for automotive applications.


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    Titel :

    New transfer-mold power module series for automotive power-train inverters


    Beteiligte:
    Ishihara, M. (Autor:in) / Hiyama, K. (Autor:in) / Yamada, K. (Autor:in) / Radke, T. (Autor:in) / Honsberg, M. (Autor:in) / Nakano, T. (Autor:in)


    Erscheinungsdatum :

    2012


    Format / Umfang :

    6 Seiten, 9 Bilder, 2 Tabellen, 1 Quelle



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Datenträger


    Sprache :

    Englisch




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